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Promotion factory WDS-650 automatic BGA rework station all brand  motherboard repair equipment
Promotion factory WDS-650 automatic BGA rework station all brand  motherboard repair equipment
Promotion factory WDS-650 automatic BGA rework station all brand  motherboard repair equipment
Promotion factory WDS-650 automatic BGA rework station all brand  motherboard repair equipment
Promotion factory WDS-650 automatic BGA rework station all brand  motherboard repair equipment
Promotion factory WDS-650 automatic BGA rework station all brand  motherboard repair equipment
Promotion factory WDS-650 automatic BGA rework station all brand  motherboard repair equipment
Promotion factory WDS-650 automatic BGA rework station all brand  motherboard repair equipment

Promotion factory WDS-650 automatic BGA rework station all brand motherboard repair equipment

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≥1 Pieces
US $4500
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Quick Details

Use:
repair different motherboard
Weight (KG):
60 KG
After-sales Service Provided:
Online support
Power supply:
AC 110V/220V±10V
Business type:
Professional manufacturer
Heating way:
top/bottom hot air, infrared heating plate
PCB size:
410*380mm
Chip magnification:
2-50x
Temperature accurancy:
±1 ℃
PCB size::
450*430mm,10*10mm
Applicable PCB thickness:
0.3-5mm
Mounting accuracy:
± 0.01mm

Quick Details

Place of Origin:
Guangdong, China
Brand Name:
WDS motherboard repair machine
Dimensions:
880*880*720mm
Use:
repair different motherboard
Weight (KG):
60 KG
After-sales Service Provided:
Online support
Power supply:
AC 110V/220V±10V
Business type:
Professional manufacturer
Heating way:
top/bottom hot air, infrared heating plate
PCB size:
410*380mm
Chip magnification:
2-50x
Temperature accurancy:
±1 ℃
PCB size::
450*430mm,10*10mm
Applicable PCB thickness:
0.3-5mm
Mounting accuracy:
± 0.01mm
Where WDS-650 can be used?
Our advantage
1.Top hot air flow is adjustable, to meet the demand of any chips.
2.Desoldering, mounting and soldering automatically.
3.Built-in infrared laser positioning, help fast positioning for PCB.
4.Top heating head and mounting head 2 in 1 design.
5.Mounting head with built-in pressure testing device, to protect the PCB from being crushed.
6.Build-in vacuum in mounting head pick up BGA chip automatically after desoldering completed.
Product Description
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Packaging & Shipping
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